Sectioning can be categorized as either abrasive cutting or precision wafer cutting.
Pace Technologies Abrasive Blades are available in sizes Ø10", Ø12", Ø14" and Ø16" to provide optimal cutting effiency in materials sectioning.
Diamond Wafering Blades
Precision wafer cutting is used for sectioning very delicate samples or for sectioning a sample to a very precise location.
Unlike abrasive blades, precision wafer cutting minimize cutting damages due to it's frequent use of Diamond Wafering Blades.
Pace Technologies Diamond Wafering Blades are available in high or low concentration and sizes vary in Ø3", Ø4", Ø5", Ø6" and Ø7" diameter.